P396 – 4″ UHV sputter deposition CEITEC
Application
UHV sputter deposition system for thin film and multilayer deposition at 4″ substrates
Year of delivery
2015
Installation site
CEITEC, Brno, Czech republic
Design Features
- UHV magnetron sputter deposition system with confocal sputter up configuration.
- Up to nine 2″ magnetrons in confocal configuration.
- 2″ magnetrons with manual in situ tilting.
- Four magnetrons with easy changeable magnetic system for use with ferromagentic or non-ferromagnetic target materials.
- RF – DC switching unit installed.
- High power impulse magnetron sputtering (HiPIMS) possible.
- Fully motorized 2 axes sample manipulator with integrated sample shutter, DC Bias potential option and maximal sample temperature well above 800°C.
- Integrated bake out system.
- Load lock chamber with installed lamp heating option and oxidation setup.
Special Features
- Face to face sputtering possible by using sample holders with tilted samples.
- System is prepared to be added to a cluster tool via second transfer port at sputtering chamber
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber
Size
700 mm diameter, about 750 mm height
Material
stainless steel
Load lock chamber
Size
200 mm diameter, about 300 mm height
Material
stainless steel
Vacuum
Sputtering chamber
Base pressure
< 3 *10-9 mbar
Pump down time
< 7 hours to < 5 * 10-7 mbar
Chamber pumping
Turbo pumping stage, chamber lid differentially pumped by dry foreline pump
Bake out
< 150°C
Load lock chamber
Base pressure
< 10-7 mbar
Pump down time
2.5 hours to < 10-7 mbar
Chamber pumping
Turbo pumping stage with dry foreline pump
Manipulator features
Sputtering chamber
Sample size
diameter max. 4″ substrate
Motion axes
2 motorized axes (manipulator z translation and (continous) rotation of the sample stage)
Pneumatic sample shutter (part of the manipulator head)
Temperatures
Room temperature (not stabilized) up to 850°C at sample
Special features
Sample bias (RF, DC or pulsed DC) is possible
Sample preparation features
Load lock chamber
Oxydation / Nitration
max. 10-2 mbar neutral oxygen / nitrogen gas (using a manual gas dosing valve)
Thermal treatment
max. 450°C at sample (no temperature regulation)
Performance test results
Chamber pump down
Long time sample heating
