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P364 – 1″ UHV sputter deposition Kazan


UHV sputter deposition system for thin film and multilayer deposition at 1″ substrates

Year of delivery


Installation site

Kazan Federal University, Russia

Design Features

  • UHV magnetron sputter deposition system with combination of confocal and face to face sputter up configurations.
  • Up to eight 2″ magnetrons in confocal configuration and max. one 2″ magnetron in face to face configuration.
    • All magnetrons with manual in situ tilting.
    • All magnetrons with easy changeable magnetic system for use with ferromagentic or non-ferromagnetic target materials.
  • Partly motorized 2 axes sample manipulator with integrated motorized sample shutter, RF Bias potential otion and maximal sample temperature above 600°C.
  • Two motorized wedge shutters (oriented perpendicular to each other).
  • Thickness sensor setup for sputter rate check before deposition and deposition end point detection.
  • Integrated bake out system.

Special Features

  • System is prepared to be added to a cluster tool via transfer port at sputtering chamber.
  • Handling of typical 1″ analytic sample holders possible.

Outer Dimensions

Technical specifications and performance values


Sputtering chamber


600 mm diameter, about 690 mm height


stainless steel


Sputtering chamber

Base pressure

< 2 *10-9 mbar

Pump down time

1 hour to < 10-6 mbar

Chamber pumping

Turbo pumping stage, chamber lid differentially pumped by dry foreline pump

Bake out

< 150°C

Manipulator features

Sputtering chamber

Sample size

diameter max. 1″ substrate

Motion axes

manualmanipulator z translation

motorized (continous) sample stage rotation

two motorized wedge shutters (mounted at chamber system) with variable motion speed and user defined positioning


Room temperature (not stabilized) up to 600°C at sample

Special features

Use of samples with inplane as well as out of plane magnet assamblies is possible

Performance test results

Chamber pump down
Long time sample heating